Core product
Back Grinding
Fully automated high rigidity 3-axis grinding, 8/12” wafer processing compatible
Wafer Backside Marking Strip Marking
Compatible with dual Loadport loading structure design High-precision backside wafer marking Widely applicable to multiple types of materials
Fully Automatic Wafer Laser Grooving / Full Cut Equipment
Higher efficiency, better stability 8/12 inch compatible, supports nanosecond/picosecond Dual multi-beam parallel processing
Fully Automatic Wafer Stealth Dicing Equipment
8“/12” compatible to realize higher WPH multi-process to meet the system expansion function.
Fully automatic 12-inch wafer polishing machine
Fully automatic 12-inch wafer polishing machine
Fully automatic 8-inch thinning machine
Fully-automated lapping machine with two spindles and three tables, compatible with 4/5/6/8-inch wafer processing
TSV Wafer Drilling Equipment
High-speed, high-precision machine design Various processing methods available
Become a leading global supplier of semiconductor equipment.

Jiangsu Yuanfu Semiconductor Technology Co., Ltd.  as a core subsidiary of Wuxi Pilot Holding, which is dedicated to the research, development, production and sales of cutting, grinding and polishing semiconductor equipment and related consumables. The main business is advanced packaging laser solutions, thinning machine, CMP equipment, polishing pads, thinning wheels and other semiconductor precision processing equipment and corresponding consumables, to provide high-end semiconductor equipment and services for global customers.

With the mission of “breaking down technical barriers, replacing imported products with domestic ones and heading towards the international market”, the company gathers excellent R&D talents at home, and the core team originates from the internationally famous semiconductor equipment enterprises which have decades of experience in the R&D and manufacturing of thinning and polishing and laser equipment.

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14000+

+ Square meter
Floor space

200+

+ number
Number of employees

70+

+ item
Intellectual property
World Class Semiconductor Equipment Company
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