Stealth Dicing
Fully Automatic Wafer Stealth Dicing Equipment
Highly efficient processing rates
Exclusive customized maintenance-free fiber laser
Stable automated handling system
Equipment Characteristics
Wafer size : 8-12inch
Speed: 1000mm/s
Position accuracy : ±1.0μm
Platform repetition accuracy : ±0.5μm
Automatic height matching : Cover
Maximum cutting thickness : 1.7mm
Equipment Configuration
Lasers
Customized Fiber Lasers
Visual system
Dual Digital Imaging System
Optical system
Maintenance-free, ultra-stable optical path
Exercise platforms
Multi-axis linkage
Machine structure
Marble platform
Auxiliary equipment
Laser altimetry system
Performance Parameters
Suitable product size
8“, 12” wafer compatible (customizable)
Tempo
1000mm/s
Positional accuracy
±1.0μm
Material thickness
≤2mm(Depending on the material)
Platform Repeatability
≤ ±0.5µm
Precision of the whole machine
＜±1µm
Automatic height matching
Cover
Maximum cutting thickness
1.7mm
Equipment Size
1700x2200x2050mm（Tricolor light not included）
