About Yuanfo Semiconductor

Becoming a global leader in semiconductor equipment suppliers

Jiangsu Yuanfu Semiconductor Technology Co., Ltd.  as a core subsidiary of Wuxi Lead Intelligent Equipment Co., Ltd. (LEAD), Dedicated to the research, production, and sales of cutting, grinding, and polishing equipment for semiconductors and related consumables. Our primary focus encompasses advanced packaging laser solutions, thinning machines, CMP equipment, polishing pads, thinning grinding wheels, and other precision processing tools for semiconductors along with their corresponding consumables. We provide high-end semiconductor equipment and services to clients worldwide.

Corporate Video

14000

+

Floor space

200

+
number

Number of employees

70

+
item

Intellectual property

Breaking down technological barriers and replacing imports with domestic production

The company to “break the technical barriers, domestic alternative to imports” for the mission, gathering excellent R & D talent at home, the core team from the world's leading semiconductor equipment companies with decades of experience in thinning and polishing, laser equipment research and development and manufacturing.
The company through the flat management mode, professional, efficient and high-quality for the semiconductor industry, high-end customers continue to provide more satisfactory products and services, while integrating and perfecting the global industrial chain, to promote China's semiconductor industry to achieve better and faster forward development of the core technology independently, and gradually become a global semiconductor equipment supplier leading enterprises.

70

+

term

Honor

annually as a percentage of sales 5% Above investment in technology research and development,The R&D team has100 multiplayer, Possession of new patents, design patents, software copyrights up to50+ classifier for principles, items, clauses, tasks, research projects etc。
More Honors

Detection window determination method and device

A laser-induced cutting method and device

Exercise platforms

A fully automatic laser processing equipment

Jiangsu Semiconductor Association Member Certificate

laser cutting machine

March

Frontend laser equipment delivery to customers
March

May

Assembly of the first thinning equipment completed and process commissioning started

June

CMP Business Unit Launches R&D and Design

December

Laser Division Business Integration
May
June
December

January

Launch global recruitment and start building teams

March

Jiangsu Yuanfo Japan R&D Center was established

June

Thinning Division Launches R&D and Design
January
March
June

July

Jiangsu Yuanfu Semiconductor Technology Co.
July

2024

2024
2023
2022
2020

Company culture

Company Mission

Creating Value for Customers Seeking Well-Being for Employees

01

Company Vision

Become a respected world-class packaging, CMP equipment company

02

Company Values

Customer-centered, hard-working, honest and pragmatic, selfless and responsible, comprehensive innovation

03

Company Talent Concept

Integrity, kindness, intelligence, competence.

04

Execution Philosophy

Focus, excellence, word of mouth, fast.

05

Detection window determination method and device

A laser-induced cutting method and device

Exercise platforms

A fully automatic laser processing equipment

Jiangsu Semiconductor Association Member Certificate

laser cutting machine

Join hands with Leadlap to promote a new era of semiconductor equipment in China
Collaborate Now