Fully automated lapping machine with two spindles and three tables for 4/5/6/8” wafer processing.

Si, SiC and other grinding materials can be satisfied.

In order to realize high-quality grinding process, the main machine is equipped with high power output, high rigidity, low vibration air spindle; the table spindle is also equipped with high rigidity, low vibration, low thermal expansion, high rotary accuracy air bearings.

Equipped with contact thickness measurement module to realize closed-loop system control.

Equipped with self-developed 250mm grinding wheel, effectively removing the stress of wafer grinding, reducing surface damage and ensuring the strength of the chip.