Wafer Polishing Equipment
Fully automatic 12-inch wafer polishing machine
In response to the current trend of localization in high-end IC manufacturing, we have developed a 12-inch fully automated high-capacity CMP (Chemical Mechanical Polishing) equipment, which meets the needs of customers for multiple process application scenarios, provides total solutions, minimizes the cost of equipment operation and maintenance, and improves the output rate per unit of surface area/per unit of time.
Equipment Characteristics
Multi-thread running goods, high WPH
Modular layout, partition maintenance
Self-developed multi-zone grinding head
Dry in and dry out, Marangoni Tira drying
Matching with online measurement IM to realize APC.
High speed response, high precision Endpoint technology
Used in Oxide/Si/STI/W/Cu/Poly and other CMP processes.
Supports overhead crane system to realize fully automated labor dispatching.
Compatible with industrialized production system MES/RMS/FDC/PMS etc.
With independent intellectual property innovation technology
Standard machine size: L5.7m*W2.8m*H2.7m
