TSV Wafer Drilling Equipment
High-speed, high-precision machine design Various processing methods available
Equipment Characteristics
Suitable for laser drilling of multilayer composites, ABF, EMC and other materials.
Equipped with HBC optical control system, supporting precise control of single pulse energy and number of rounds.
Support spot shaping and adjustable spot size.
High-precision platform structure design, equipped with high-speed precision linear motor module and full closed-loop numerical control system.
Equipped with high-resolution CCD image positioning technology.
Modular design, can be customized according to the actual needs of the components
Self-developed software control system
Equipment Specifications
Lasers
Customized nanosecond UV lasers
Visual system
High Precision Visual Positioning System
Optical system
Customized HBC light path control system
Exercise platforms
Six-axis linkage, ultra-precision motion stage
Machine structure
Marble platform
Performance Parameters
Worktop
8“, 12” wafer compatible (customizable)
Platform Repeatability
±1µm
Vision System Accuracy
±1um
Machining precision of the whole machine
±5µm
Visual system
500W pixel/2000W pixel CCD camera
Spot Type
Top-hat Spot
Optical system
High-speed laser control module
Linkage system
6-axis linkage system
Equipment Size
1820*1500*1850 (without tricolor lamp)
