Backside wafer thinning equipment
Back Grinding
Equipment Characteristics
8" / 12" compatible：Compatible with 200mm and 300mm wafers
Achieve higher productivity：3axes, 4 chuck tables, high rigidity design of machine structure, third axis grinding wheel design, etc.
Meet multi-process requirements：Can meet processes such as DAG, DBG, SDBG, etc
System Extension Functions：can cooperate with the film sticking machine to complete the whole process of thinning, film sticking, film tearing and marking at one time
Equipment Specifications
Maximum Wafer Size (mm)
300
Z-axis resolution (μm)
0.1
Grinding wheel spindle power (kw)
5.5
Maximum wheel speed (rpm)
4000
Maximum table speed (rpm)
500
Minimum machining thickness (si)
50
Total Thickness Deviation TTV (μm)
≤2.5
Sheet to Sheet Thickness Deviation WTW (μm)
±2.5
