L1-7100 (nanoseconds) L1-7500 (picoseconds)
Fully Automatic Wafer Laser Grooving / Full Cut Equipment
Higher efficiency, better stability 8/12 inch compatible, supports nanosecond/picosecond Dual multi-beam parallel processing
Equipment Characteristics
Suitable for laser grooving of materials such as Low-k, aluminum nitride (AlN), alumina ceramics, etc.
Suitable for materials such as silicon and gallium arsenide (GaAs)， thickness below 200μm thin wafers without chipping high-quality full cut.
8/12 inch compatible, supporting nanoseconds/picoseconds.
Dual multi-beam parallel processing.
Can achieve continuous adjustable groove width of 10-90 µm.
Processing ultra-narrow cutting path within 10μm Overall accuracy ：＜±1µm.
Performance Parameters
processing width
Compatible with 8-inch and 12-inch wafers (customizable), nanosecond/picosecond selectable support
Material thickness
≤1.6mm (depending on material)
minimum spot
8µm
Platform Repeatability
≤ ±0.7µm
Precision of the whole machine
＜±1µm
Equipment Size
1550x2000x1985 (without tricolor light)
