On May 22-24, 2024, the 26th Annual IC Manufacturing Conference & Supply Chain Innovation & Development (CICD) was held in Guangzhou Huangpu District Knowledge City International Convention & Exhibition Center. As a leading thinning polishing and laser equipment company in China, Yuanfo Semiconductor showed up at Booth No. 61 with a number of heavyweight products, attracting wide attention from the guests and media.

CICD is one of the most influential annual IC manufacturing industry events in China. This year's conference, with the theme of “Facilitating Industrial Path Innovation and Building Independent Industrial Ecology”, brings together national ministries and commissions, provincial and municipal governments, industry associations, industry alliances, scientific research institutes, and experts of all kinds to discuss industry hotspots and promote cutting-edge achievements. Hundreds of exhibitors gathered on the scene, attracting many professional visitors from home and abroad.

In this exhibition, Leadlap brought two important products, semiconductor thinning machine LDG3000 and semiconductor chemical mechanical polishing machine CMP. Attracting many industry professionals and partners, they became the focus of attention at the exhibition. Among them, the semiconductor thinning machine LDG3000 is a high rigidity three-axis wheel thinning machine, which can realize higher production efficiency. It is highly compatible with 8“ and 12” wafers, 200mm and 300mm wafers. At the same time, it can achieve low cost, high quality, high precision, high UPH processing; matching with Yuanfu grinding wheel to achieve stable and efficient grinding; customized grinding wheel to meet different product requirements.

Another equipment semiconductor chemical mechanical polishing machine CMP, the machine adopts the latest layout, provides a variety of process mode selection, can realize 300mm wafer fully automatic. At the same time, it is modular design, each process unit runs separately, maintenance does not affect each other; optimized to reduce the transfer waiting time, greatly improving the WPH.

During the two-day exhibition, as a pioneer in the field of thinning polishing and laser equipment in China, Yuanfo Semiconductor has been highly recognized by industry customers for its core technology, R&D strength, product innovation, business layout and other dimensions.The trip to CICD 2024 has been successfully concluded, and Yuanfo Semiconductor will focus on the industry's development, adhering to the development concepts of technological leadership and independent innovation, and continue to increase investment in R&D and strengthen industry chain upstream and downstream cooperation, contributing to the high-quality development of China's IC industry! We will continue to increase R&D investment, strengthen upstream and downstream cooperation, and contribute to the high-quality development of China's IC industry!