L3 Series
Wafer Backside Marking Strip Marking
Compatible with dual Loadport loading structure design High-precision backside wafer marking Widely applicable to multiple types of materials
Equipment Characteristics
Compatible with Loadport and Cassette loading structure design.
Fully automatic wafer robot handling.
Suitable for various materials, with a wide range of applications.
Equipped with core HBC technology, efficient operation.
Compatible with up to 10mm warped soft wafers.
Overall accuracy ：±50µm.
Equipment Configuration
Luminaire
Customized Green Laser
Visual system
Digital Imaging Systems
Optical system
Maintenance-free, ultra-stable optical path
Exercise platforms
Multi-axis linkage
Machine structure
Marble platform
Performance Parameters
Suitable product size
8“ and 12” wafer compatible
Vision System Accuracy
±10µm
Platform Repeatability
±5µm
Precision of the whole machine
±50µm
Equipment Size
2850x1850x1900mm (without loadport and tri-color light)
