laser ring cutting&remove
Fully Automatic Wafer laser ring cutting&remove
Double loadport feeding, dual-arm robot with flip mechanism for picking up wafers
Equipment Characteristics
Wafer size: 8-12inch
Double loadport feeding, dual-arm robot with flip mechanism for picking up wafers
Double fully automatic wafer-picking stations
High-efficiency and precise UV light source de-bonding
Wafer ring cutting precision <0.15mm
Equipment size：2060mm*2050mm*2300mm（Excluding tricolor lightes）
